The Heimish All Clean White Clay Foam is formulated with the famous Amazon white clay, which is well known for its ability to effectively control sebum and remove any impurities from pores. The rich, whipped cream foam offers a deep cleanse and a moisturized finish thanks to the hyaluronic ingredients and many natural herb oils. Suitable for all skin types.
Individual results may vary
Made in Korea
Wet hands and face. Work a small amount of cleanser into lather and massage onto face, avoiding eyes area. Rinse thoroughly with lukewarm water.
Aqua, Glycerin, Stearic Acid, Myristic Acid, PEG-32, Potassium Hydroxide, Lauric Acid, Bentonite, Potassium Cocoate, Butylene Glycol, Cocamidopropyl Betaine, Potassium Cocoyl Glycinate, Glyceryl Stearate, PEG-100 Stearate , Kaolin, Citrus Aurantium Dulcis (Orange) Peel Oil, Lavandula Angustifolia (Lavender) Oil , Amyris Balsamifera Bark Oil, Pelargonium Graveolens Flower Oil, Cocos Nucifera (Coconut) Oil, Citrus Paradisi (Grapefruit) Peel Oil, Litsea Cubeba Fruit Oil, Eucalyptus Globulus Leaf Oil, Melaleuca Alternifolia (Tea Tree) Leaf Oil, Mentha Arvensis Leaf Oil, Boswellia Carterii Oil, Citrus Aurantium Bergamia (Bergamot) Fruit Oil, Juniperus Mexicana Oil, Myristica Fragrans (Nutmeg) Kernel Oil, Tagetes Minuta Flower Oil, Jasminum Officinale (Jasmine) Flower/Leaf Extract, Nelumbo Nucifera Flower Extract, Freesia Refracta Extract, Iris Versicolor Extract, Leontopodium Alpinum Flower/Leaf Extract, Lilium Candidum Bulb Extract, Narcissus Pseudo – Narcissus Flower Extract, Rose Extract, PEG-75, Polyquaternium-7, Hyaluronic Acid, Hydrolyzed Hyaluronic Acid, Sodium Hyaluronate, Ethylhexyl Glycerin, Hydrolyzed Silk, Disodium Edta, Sodium Benzoate, Phenoxyethanol, Fragrance
Disclaimer: While we try to keep the ingredient list as accurate as possible, ingredients are subject to change at brands' discretion. The product packaging will have the latest up-to-date information. If you have any concerns about certain ingredients or new formulations, be sure to contact us prior to purchase.